On March 26, 2024, Beijing time, the chip interconnect technology startup headquartered in Santa Clara, USA, Eliyan announced that it has raised $60 million in Series B funding, led by Samsung Catalyst Fund and Tiger Global, with existing investors Intel Capital, SK Hynix, Cleveland Avenue, and Mesh Ventures also participating in this round.
Founded in 2021, Eliyan provides chiplet interconnect technology that can accelerate the processing speed of AI chips. The company says Eliyan's chiplet interconnect technology can deliver up to four times the performance of other solutions while using only half the power. In addition to die-to-die interconnect in chiplet-based designs, the company also addresses the growing challenges of memory capacity and bandwidth in AI chips through its innovative Universal Memory Interface (UMI).
(Source:VentureBeat）